Bendable carrier mount, device and method for releasing a carrier substrate

ABSTRACT

A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.

RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/008,696, filed Sep. 30, 2013, which is a U.S. National StageApplication of International Application No. PCT/EP2011/055630, filedApr. 11, 2011, said patent applications hereby fully incorporated hereinby reference.

FIELD OF THE INVENTION

The invention relates to a flexible carrier mount, a device fordetaching a carrier substrate from a product substrate in one detachmentdirection L, a corresponding method and a use of a flexible carriermount for mounting a carrier substrate in the debonding of a carriersubstrate from a product substrate.

BACKGROUND OF THE INVENTION

In the semiconductor industry structure wafers or product wafers areoften temporarily bonded to carrier wafers or carrier substrates inorder to be able to handle them. After processing of the productsubstrates, they should be removed from the carrier substrate as easily,promptly, economically and cleanly as possible. The most frequently usedmethod for bonding of product wafers on a carrier wafer is theapplication of an adhesion layer to one of the two substrates (or bothsubstrates) and making contact under pressure. During debonding, thecarrier wafer is debonded from the product wafer after reducing theadhesion force of the cement (temperature, UV radiation, etc.), forexample by parallel shifting of the wafers against one another. Thewafers are held by so-called chucks by negative pressure.

During debonding, a plurality of critical factors must be considered andthe top priority is to expose the brittle product wafer which is veryexpensive due to preprocessing to as little stress as possible and tonot damage it. The carrier substrate should be debonded on the otherhand economically and promptly with as little energy consumption aspossible. In a plurality of known debonding processes it is necessary,especially for breaking up the adhesion properties of the adhesion layerbetween the wafers, to heat the stack of carrier wafers and structurewafers/product wafers to a temperature which is specific to the cement.

SUMMARY OF THE INVENTION

The object of this invention is therefore to develop the generic devicesand methods for debonding of carrier substrates such that carefuldebonding which is at the same time much quicker is enabled. At the sametime the energy consumption will be reduced.

This object is achieved with the features of the independent claims(s).Advantageous developments of the invention are given in the dependentclaims. All combinations of at least two of the features given in thespecification, the claims and/or the figures also fall within theframework of the invention. At the given value ranges, values within theindicated limits will also be disclosed as boundary values and will beclaimed in any combination.

The basic idea of this invention is to engineer a carrier mount formounting of the carrier substrate in the detachment of the carriersubstrate from the product substrate such that the carrier mount is madeto allow bending of the carrier substrate. The carrier mount has abending stiffness which is sufficient to cause a detachment force fordebonding of the carrier substrate from the product substrate,especially by lifting from the edge of the carrier substrate.

According to the present invention, only a slight bowing should occur,especially <45° bending angle, preferably <40°, more preferably <30°,especially preferably <20°, even more preferably <10°, most preferably<5°. In this way the carrier substrate which also has a certain bendingstiffness which is similar to the carrier mount, and above all theproduct substrate are protected against damage. Bending causes most ofthe detachment force on the migrating detachment front which migratesespecially from the edge of the carrier substrate in the direction ofthe center.

The heart of the invention is therefore a flexible carrier mount formounting of a carrier substrate in the detachment of the carriersubstrate from a product substrate, detachment means being provided fordebonding of the product substrate with bending of the carrier substrateon the carrier mount.

Therefore blanket, non-annular versions of the carrier mount, especiallyof a polymer with a certain elasticity or bending strength, are alsoconceivable. To fix and hold the carrier substrate they would havevacuum passages. In this connection, especially in addition toincreasing the holding force, there can be electrostatic fixing of thecarrier substrate on the carrier mount.

The carrier mount can also consist at least partially of metal, ceramicor a composite material. The materials used need allow only thefunctionality as described herein.

An independent invention is moreover a device for detaching a carriersubstrate from a product substrate in one detachment direction L withthe following features: a carrier mount which is flexible in thedetachment direction L for mounting of the carrier substrate, —asubstrate mount for mounting of the product substrate, detachment meansfor debonding of the carrier substrate from the product substrate withbending of the carrier substrate.

The detachment direction L is essentially, in particular exactly, normalto the surface of the carrier substrate and/or product substrate. Onebending axis of the bending of the carrier mount and/or of the carriersubstrate held by the carrier mount is normal to the detachmentdirection L. The bending axis is especially parallel to the surface ofthe product substrate and/or of the carrier substrate.

In one advantageous version of the present invention the device canadvantageously comprise a pressure chamber which can be exposed tooverpressure in order to fix a carrier substrate which has been fixedwith negative pressure on the carrier mount more strongly to it. Thepressure in the chamber can be >1 bar, preferably >2 bar, even morepreferably >5 bar, still more preferably >10 bar, especially less than100 bar.

According to one advantageous embodiment of the invention it is providedthat the carrier mount is elastically deformable in the detachmentdirection L. The elasticity of the carrier mount makes it possible toconcentrate the detachment force on the migrating detachment front,although a tensile force is applied only on the periphery of the carriersubstrate.

In another advantageous version of the invention it is provided that atleast one tensile force acting on the periphery of the substrate mountand at least one opposing force acting against the tensile force on theperiphery of the carrier mount can be applied by the detachment means toproduce detachment moments along one detachment front. In this way thetotal load, especially at the start of debonding, can be reduced. Inthis way greater protection of the carrier substrate and of the productsubstrate is afforded. It is provided in particular that the tensileforces add up, especially by uniform application of tensile forces onthe periphery of the substrate mount, to a resulting tensile force inthe center of the substrate mount, while the opposing force or theopposing forces add up to a resulting opposing force on one edge of thecarrier mount and corresponding detachment moments on the migratingdetachment front. The carrier mount is accordingly tilted relative tothe substrate mount.

For better protection of the product substrate, especially for verysensitive or very expensive product substrates, it is provided that thesubstrate mount be made as a rigid receiver which holds the productsubstrate over the entire surface.

According to another advantageous embodiment of the invention, it isprovided that the carrier mount be made as an especially open ring withan adjustable inside diameter D_(i). The bending stiffness can beoptimally adjusted to the carrier substrate due to the ring shape alsoby the ring geometry, especially the ring width B to the ring diameterD_(a), and/or to the height H of the ring. The ring shape furthermoreresults in that in the region of the ring opening greater freedom ofmotion of the carrier substrate is allowed so that an interaction of thebending stiffness of the carrier mount and the bending stiffness of thecarrier substrate is achieved. Here the bending stiffness of the carriermount is especially at least equal to or greater than the bendingstiffness of the carrier substrate.

The bending stiffness of the carrier mount is advantageously chosen suchthat it lies in a range between 1/20 to 20 times, especially between1/10 to 10 times, preferably between ⅕ to 5 times, even more preferablybetween ½ to 2 times, the bending stiffness of the carrier substrate.The carrier substrate is especially a wafer of silicon with a thicknessd between 500 μm and 750 μm, preferably of 600 μm. It can have adiameter D_(t) of 200 mm or 300 mm.

Here it is especially advantageous to provide holding means which runespecially over the entire ring periphery, especially in the form of arebounding peripheral shoulder. Thus, with a simple geometrical shapewhich can be economically produced, both the detachment force can beapplied to the carrier substrate, especially on the entire periphery ofthe carrier substrate, and the especially critical initiation of thedetachment front at the start of debonding can be concentrated at one ormore sites on the periphery of the carrier substrate.

In one development it is provided that the carrier mount is made tolaterally surround the carrier substrate essentially completely,especially at least to 98% of the periphery, preferably at least to 99%,even more preferably to at least 99.5%. In this way the carriersubstrate is supported more or less over the entire periphery. Thecarrier mount is made especially as a ring which is peripherally closedpreferably at least up to 98% of the periphery, even more preferably atleast to 99%, still more preferably at least to 99.5%. The ring can alsobe composed of individual sections.

According to one advantageous embodiment, the detachment means havetranslational drive means for causing a translation movement of at leastone peripheral section of the carrier mount in the detachment directionL.

An independent invention is a method for detaching a carrier substratefrom a product substrate in one detachment direction L with thefollowing steps, especially the following sequence: mounting of theproduct substrate with a substrate mount and mounting of the carriersubstrate with a carrier mount which is flexible in the detachmentdirection L and debonding of the carrier substrate from the productsubstrate with bending of the carrier substrate.

Furthermore, there is a use of a flexible carrier mount for mounting ofa carrier substrate when the carrier substrate is debonded from aproduct substrate.

In one advantageous embodiment of the invention it is provided that thedebonding takes place at a temperature <200° C., preferably <100° C.,even more preferably <50° C., ideally at ambient temperature, especiallywithout blanket heating means.

It is conceivable to accelerate the debonding, especially on thedetachment front, by action of the detachment means, especially byseparating means, locally on the detachment front. The separating meanscan comprise mechanical separation and/or local heating, preferably adirected hot air flow. Specifically a separating wedge, a separatingblade, a separating wire or a preferably hot compressed air jet directedat the detachment front can be provided individually or in combination.

A separating wedge is defined as a tool with a preferably v-shapedprofile. A separating blade is defined as a tool with an extremely sharpedge. The separating wire is a very thin, preferably high strength wirewhich is moved by a corresponding apparatus in the tensioned state inthe plane of the intermediate layer toward it. The separating wire ismade especially as a heated wire, therefore able to be heated.

In one embodiment of the invention it is also conceivable in which thedetachment front runs more or less in a spiral during the detachmentalong the periphery of the product substrate to the inside toward thecenter. This is achieved by the detachment forces which are acting onthe periphery being increased running around the periphery.

The described features apply analogously to the device of the presentinvention and the method of the present invention as well as the use ofthe present invention.

Other advantages, features and details of the invention will becomeapparent from the following description of preferred exemplaryembodiments and using the drawings:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a plan view of one carrier mount according to the presentinvention with a cutting line A-A,

FIG. 2 shows a cross sectional view of the carrier mount according tocutting line A-A from FIG. 1,

FIG. 3 shows a view of the carrier mount according to FIG. 1 fromunderneath,

FIG. 4 shows a detailed view of detail E from FIG. 2,

FIG. 5a shows a side view of a stack composed of the carrier substrate,interconnect layer and product substrate,

FIG. 5b shows a plan view of a stack composed of the carrier substrate,interconnect layer and product substrate,

FIG. 6 shows a detailed view analogously to FIG. 4 with a firstembodiment of the carrier mount,

FIG. 7 shows a detailed view analogously to FIG. 4 with a secondembodiment of the carrier mount,

FIG. 8 shows a stack fixed on a film frame,

FIGS. 9a-9d show a first embodiment of the device with four method stepsand

FIGS. 10a-10d show a second embodiment of the device with four methodsteps.

The same components or components with the same function are identifiedwith the same reference numbers in the figures.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 shows a carrier mount 1 which can be used semiautomatically, andin which the carrier substrate 13 is held manually by the carrier mount1. The carrier mount 1 is used for debonding the carrier substrate 13from a product substrate 11 which is connected to the carrier substrateby an interconnect layer 12.

The carrier mount 1 consists of a holding handle 2 which is located onone peripheral section 26 and of a ring 3 which is opened opposite theholding handle 2. On the opening 3 o of the ring 3 there are spacingmeans 25 for adjustment of the spacing A between the ends 24, 24′ on theopposite ends 24, 24′ of the ring 3. An inside diameter D_(i) and anoutside diameter D_(a) of the ring 3 can be adjusted by adjusting thespacing A. The spacing means 25 in this exemplary embodiment consist oflevers 4, 5, the lever 4 being attached on the end 24 and the lever 5 onthe end 24′. The levers 4, 5 are penetrated by positioning elements 14which can be operated manually here. Automatic re-positioning of theabove described manual kinematics is conceivable.

The holding handle 2 is attached to the ring 3 by fixing elements 10,especially screws. The material of the ring 3 for a given geometry (ringheight H, ring width B, outside diameter D_(a), inside diameter D_(i))should be chosen such that the ring 3 can be elastically bent by thespacing means 25 against its force caused by the bending stiffness.

The ring 3 has a peripheral shoulder 7 which projects away from a ringshoulder 6, and a step 9. The step 9 runs in a z-shape with an insideangle 45°<I<90°, especially <80°, preferably <70° pointed toward themiddle of the ring and thus forms an especially peripherally runningwall bevel 17 which ends on a sharp inner edge 8. The inner edge 8 is atthe same time a component of a face surface 7 s of the peripheralshoulder 7, which surface runs parallel to the ring shoulder 6. The facesurface 7 s is equidistant to the ring shoulder 6 with a distance M. Thedistance M is chosen such that it is at most slightly larger, especiallyat most larger by the thickness of the interconnect layer 12, than onethickness d of the carrier substrate 13 (see FIG. 7). Preferably thedistance M is chosen as shown in FIG. 6 such that it is smaller than thethickness d of the carrier substrate 13. Preferably the distance M is atleast half as great as the thickness d of the carrier substrate 13.

A diameter D_(k) which lies between the inside diameter D_(i) and theoutside diameter D_(a) for holding the carrier substrate 13 and which isformed by the inner edge 8 can be increased by the spacing means 25until the carrier substrate 13 can be inserted through an opening(diameter D_(k)) formed by the inner edge 8 as far as the ring shoulder6. Then the diameter D_(k) can be again reduced by the spacing means 25until one peripheral edge 13 u of the carrier substrate 13 adjoins thebevel 17 of the peripheral shoulder 7 and is fixed by it. Thus thecarrier substrate 13 is held by the flexible carrier mount 1. Themounting takes place more or less by clamping and/or by form fit. Forclamping of the carrier substrate 13 on the bevel 17 there can bedynamometer means for control of the clamping, especially on thepositioning means 14.

The product substrate 11 is only attached to the carrier mount 1 via theinterconnect layer 12. There is no direct contact between the carriermount 1 and the product substrate 11. While avoiding contact between thecarrier mount 1 and the product substrate 11 the product substrate 11 isprotected to the maximum degree and contamination or damage isessentially precluded.

The product substrate 11 with the interconnect layer 12 and the carriersubstrate 13 forms a stack 19 (carrier substrate—productsubstrate—combination). This invention is likewise suited for acombination of carrier substrate and product substrate withoutinterposed interconnect layer, especially for so-called prebonds, inwhich the wafers adhere to one another especially by means of Van derWaals forces.

When fixing the stack 19 on the carrier mount 1 in the embodiment shownin FIG. 7 the sharp inner edge 8 is used at the same time as aseparating means or to initiate debonding by the tip of the inner edge 8on the peripheral edge of the interconnect layer 12 penetrating into theinterconnect layer 12.

The carrier mount 1 almost completely surrounds the carrier substrate13, except for the ring opening 3 o.

FIG. 8 shows the stack 19 on a film frame 23, the product substrate 11being connected to a film 21 which is joined to the film frame 23. Thestack 19, the film frame 23 and the film 21 form a film framecombination 20.

The carrier substrate 13 can be pulled off the product substrate 11 bymeans of the holding handle 2 and by fixing of the product substrate 11or of the film frame 23. The tensile force is applied laterally to thecarrier substrate 13, therefore to the peripheral section 26 by theunilateral arrangement of the holding handle 2. Initiated by thepenetration of the inner edge 8 into the interconnect layer 12, thecarrier substrate 13 with deformation of the carrier substrate 13 and ofthe ring 3 (against its force produced by the bending stiffness) isslowly debonded proceeding from the peripheral section 26 to theopposite side. Here a detachment front migrates from the peripheralsection 26 to the opposite side of the carrier substrate 13 by theinterconnect layer 12. Accordingly, depending on the distance of thedetachment front from the holding handle 2 and the detachment forceapplied to the holding handle 2, defined torques act along thedetachment front.

In automated form this is shown in FIGS. 9a to 9d in a first embodimentand in FIGS. 10a to 10d in a second embodiment, which are detailedbelow.

The use of the above described carrier mount 1 for mounting of thecarrier substrate 13 in a form suitable for automation is common to thetwo embodiments.

One important aspect of the invention consists in providing especiallycareful handling at the start of debonding, therefore when debonding isinitiated, especially by implementation of a mechanical debonding of theinterconnect layer on the periphery or on its edge.

FIGS. 9 and 10 each show one base 27 and one rack 22 which is mounted onit for providing a stable base construction and for attachment of othercomponents of the device, which are described below. On the rack 22 orthe base 27, especially between a cover 22 d of the rack 22 and a bottom27 b formed by the base 27, there are drive means 15′ for translationalmovement (especially driven) of the carrier mount 1 or of peripheralsections of the carrier mount 1 and drive means 15 for translationalmovement (especially driven) of a substrate mount 18 (receiver) whichholds the stack 19 or the film frame combination 20. The drive means 15′can have a trip-free mechanism in the direction of translation,especially formed by a movable bearing.

The substrate mount 18 in the two embodiments as shown in FIG. 9 andFIG. 10 can be moved up and/or down in translation in one detachmentdirection L, therefore in the plane of the drawing. The drive means 15for driving the substrate mount 18 can thus be moved especiallysynchronously, preferably driven by motors, especially stepping motors,which are controlled by a central control device.

In the embodiment as shown in FIG. 9, for the carrier mount 1 there isonly one drive means 15′ on the side of the carrier mount 1 opposite theperipheral section 26, while on the peripheral section 26 there is onerocker bearing 16, so that the carrier mount can be pivoted around therocker bearing 16, but is fixed in the detachment direction L. Thus thesequence of the method is as follows:

In the method step shown in FIG. 9a , the carrier mount 1 which issuitable for the film frame combination 20, especially the carriersubstrate 13, is attached to the upper drive means 15′ and the rockerbearing 16. At the same time, beforehand or subsequently, the film framecombination 20 is fixed onto the substrate mount 18, in particular byapplication of a vacuum. The substrate mount 18 can be moved by thedrive means 15 in the detachment direction L.

It is alternatively conceivable that on the periphery of the carriermount 1 there are several, especially two, drive means 15′ on one sideand several, especially two, rocker bearings 16 on the opposite side.

The carrier mount 1 can be fixed by holding means 28 which are locatedon the ring periphery 3 u on the drive means 15′ and the rocker bearing16. The substrate mount 18 can be fixed by holding means 29 on the drivemeans 15.

Then the substrate mount 18 is moved into the position shown in FIG. 9b(therefore in the detachment direction L toward the carrier mount 1) bythe drive means 15 executing a synchronous translational movement of thesubstrate mount 18 until the carrier substrate 13 with its top 13 oadjoins the ring shoulder 6. Control can take place via the centralcontrol device, the detection of the carrier substrate 13 striking thering shoulder 6 taking place by force transducers which are integratedespecially into the substrate mount 18. Preferably on the periphery ofthe substrate mount 18 there are a number n of force transducersdistributed at an angular distance of 360°/n.

So that the carrier substrate 13 can be held in the carrier mount 1, thediameter D_(k) must be matched accordingly beforehand to the inner edge8 of the ring 3 so that the carrier substrate 13 with its outsidecontour (especially circular with a diameter D_(t)) can be received intothe carrier mount 1. When the carrier mount 13 is received the insidediameter D_(i) is smaller than the diameter D_(t) of the carriersubstrate 13 so that the carrier substrate 13 does not slip through. Assoon as the position shown in FIG. 9b is reached, the inside diameterD_(i) can be reduced until the carrier substrate 13 is fixed in thecarrier mount 1 (see FIGS. 6 and 7), and therefore adjoins the wallbevel 17.

As soon as the position which is shown in FIG. 9b is reached, the upperfixable drive means 15′ is released so that it has a degree of freedomin the detachment direction L and the side of the carrier mount 1attached to the drive means 15′ can move freely in the detachmentdirection L. In this embodiment the drive means 15′ is made driveless.But a control of the motion by the central device is also conceivable sothat the drive means 15′ is made not passive (as in the preferredembodiment), but active.

Then, on the two drive means 15 which are provided opposite on thesubstrate mount 18 one drive force F₁ (tensile force) which is pointedaway from the carrier mount 1 and one drive force F₂ (tensile force)which is especially identical to the drive force F₁ are appliedespecially synchronously to the substrate mount 18 for debonding of thecarrier substrate 13 which is fixed on the carrier mount 1 from theproduct substrate 11.

Acting opposite the drive forces F₁ and F₂ and especially parallel tothem, an opposing force G (or several opposing forces G, if there areseveral rocker bearings 16) is applied to the rocker bearing 16.

In this way the debonding process which has been initiated from theinner edge 8 is continued, with increasing bending of the carrier mount1 and of the carrier substrate 13 a detachment front running from therocker bearing 16 to the opposite side of the carrier mount 1. Inequilibrium with the drive forces F₁ and F₂ as well as the opposingforce G (caused by the interconnecting force of the interconnect layer12), torques act along the detachment front as detachment moments K₁ toK_(n) which are distributed infinitesimally along the detachment front.

In the position shown in FIG. 9c , the carrier substrate 13 is debondedby more than half, debonding taking place by both the carrier substrate13 and also the carrier mount 1 deforming (against the bending strengthof the carrier mount 1 and of the carrier substrate 13).

In the position shown in FIG. 9d , the carrier substrate 13 is debondedcompletely from the product substrate 11. The interconnect layer 12 inthe figure adheres to the product substrate 11, but can also adherepartially or completely to the carrier substrate 13.

During the debonding, the carrier mount 1 and the carrier substrate 13bend by an (average, especially measured at half debonding of thecarrier substrate 13 from the product substrate 11) bending angle1°<W<45°, especially W<35°, here roughly 6°.

In the second embodiment as shown in FIG. 10a to FIG. 10d , instead ofthe drive means 15′ there is a rocker bearing 16 on the carrier mount 1so that the carrier mount 1 on the peripheral sections 26 and anopposite peripheral section 26′ (therefore where the rocker bearings 16are attached to holding means 28 of the carrier mount 1) is fixed in thedetachment direction L (there can be several rocker bearings 16 on theperiphery of the carrier mount 1). In sections between the peripheralsections 26 the carrier mount 1 is movable within the framework of itsflexibility against the bending stiffness. Thus when the drive forcesare applied in the method step according to 10 c, a detachment frontwhich runs essentially (rippled) concentrically from the periphery ofthe interconnect layer 12 arises to the middle of the interconnect layer12. Here the initiation by the inner edge 8 of the carrier mount playsan important part for overcoming the initial interconnecting force ofthe interconnect layer 12.

The detachment moments K₁ to K_(n) act in the embodiment as shown inFIGS. 10a to 10d each predominantly on one (rippled) circular sectionalong the detachment front as the detachment front progresses. While thebending angle W according to FIG. 9c to the side edge opposite therocker bearing is measured, the bending angle W′ is measured from thecenter of the carrier substrate 13 to the edge due to the detachmentforce K which acts on the periphery from all sides, the bending angle W′in this case being correspondingly smaller due to the shorter distance,insofar as the material of the carrier mount 1 and of the carriersubstrate 2 as well as their dimensions are otherwise identical. Byreducing the ring width B and/or the ring height H the bending stiffnessof the ring 3 can be reduced so that the bending angle W′ would beincreased.

REFERENCE NUMBER LIST

-   1 carrier mount-   2 holding handle-   3 ring-   3 o opening-   3 u ring periphery-   4 lever-   5 lever-   6 ring shoulder-   7 peripheral shoulder-   7 s face surface-   8 inner edge-   9 step-   10 fixing means-   11 product substrate-   12 interconnect layer-   13 carrier substrate-   13 o top-   13 u peripheral edge-   14 positioning elements-   15, 15′ drive means-   16 rocker bearing-   17 bevel-   18 substrate mount-   19 stack-   20 film frame combination-   21 foil-   22 rack-   22 d cover-   23 film frame-   24, 24′ ends-   25 spacing means-   26 peripheral section-   27 base-   27 b bottom-   28 holding means-   29 holding means-   A spacing-   B ring width-   D_(i) inside diameter-   D_(a) outside diameter-   D_(k) diameter-   H ring height-   M distance-   L detachment direction-   I inner angle-   d thickness-   F₁, F₂, F_(n) drive forces (tensile force)-   G opposing force-   K₁, K₂, K_(n) detachment moments-   W, W′ bending angles

Having described the invention, the following is claimed:
 1. A systemfor debonding a product substrate from a carrier substrate, the productsubstrate being temporarily connected to the carrier substrate by aninterconnect layer to form a stack, the system comprising: meansconfigured to support the stack; separating means comprising acompressed air jet configured to provide an air flow to initiateseparation of the product substrate from the carrier substrate andpenetrate locally into the interconnect layer of the stack from aperipheral edge of the interconnect layer; a first member having asurface extending in a plane generally parallel to a plane of a surfaceof the carrier substrate; and an extension portion extending from thefirst member, the extension portion including a surface configured tocontact a peripheral edge of the carrier substrate, wherein the systemapplies a force to the carrier substrate to bend the carrier substrateaway from the product substrate and thereby debond the product substratefrom the carrier substrate at a migrating detachment front, wherein theseparating means are independent of the extension portion and configuredto act locally on the detachment front, and wherein the air flow isheated to locally heat the detachment front to initiate separation ofthe carrier substrate from the product substrate.
 2. The system asclaimed in claim 1, wherein said first member is flexible.
 3. The systemas claimed in claim 1, wherein one end of the surface of the extensionportion terminates at an inner edge configured to contact the peripheraledge of the carrier substrate.
 4. A system for debonding a carriersubstrate from a product substrate, the carrier substrate beingtemporarily connected to the product substrate by an interconnect layerto form a stack, the system comprising: a first mount engageable withthe carrier substrate, the first mount including: a shoulder having ashoulder surface extending in a plane generally parallel to a surface ofthe carrier substrate that is in contact with the interconnect layer;and an extension portion extending from the shoulder, the extensionportion having an inner edge forming a tip that is configured to contacta peripheral edge of the carrier substrate and initiate a debondingprocess whereby the carrier substrate is separated from the productsubstrate; and separating means comprising a compressed air jetconfigured to provide an air flow to initiate separation of the carriersubstrate from the product substrate and penetrate locally into theinterconnect layer of the stack from a peripheral edge of theinterconnect layer, wherein the first mount applies a force to thecarrier substrate to bend the carrier substrate away from the productsubstrate and thereby debond the carrier substrate from the productsubstrate, said carrier substrate debonding from the product substratebeginning at a periphery of the carrier substrate at a migratingdetachment front, wherein the separating means are independent of theextension portion and configured to act locally on the detachment front,and wherein the air flow is heated to locally heat the detachment frontto initiate separation of the carrier substrate from the productsubstrate.
 5. The system as claimed in claim 4, wherein said first mountis flexible.
 6. The system as claimed in claim 4, further comprising:first drive means configured to move the first mount in order to applythe force to the carrier substrate to bend the carrier substrate awayfrom the product substrate.
 7. The system as claimed in claim 4, furthercomprising: a second mount engageable with the product substrate.
 8. Thesystem as claimed in claim 7, further comprising: first drive meansconfigured to move the first mount in order to apply the force to thecarrier substrate to bend the carrier substrate away from the productsubstrate; and second drive means configured to move said second mountrelative to said first mount.
 9. A system for debonding a productsubstrate from a carrier substrate, the product substrate beingtemporarily connected to the carrier substrate by an interconnect layerto form a stack, the system comprising: means configured to support thestack; separating means comprising a compressed air jet configured toprovide an air flow to initiate separation of the product substrate fromthe carrier substrate and penetrate locally into the interconnect layerof the stack from a peripheral edge of the interconnect layer; a firstmember having a surface extending in a plane generally parallel to aplane of a surface of the carrier substrate; and an extension portionextending from the first member, the extension portion including asurface configured to contact a peripheral edge of the carriersubstrate, wherein the system applies a force to the carrier substrateto bend the carrier substrate away from the product substrate andthereby debond the product substrate from the carrier substrate at amigrating detachment front, wherein the separating means are independentof the extension portion and configured to act locally on the detachmentfront, and wherein the separating means comprise a separating wire thatis configured to act locally on the detachment front in a tensionedstate along a plane in which the detachment front resides to initiateseparation of the carrier substrate from the product substrate.
 10. Asystem for debonding a product substrate from a carrier substrate, theproduct substrate being temporarily connected to the carrier substrateby an interconnect layer to form a stack, the system comprising: meansconfigured to support the stack; separating means comprising acompressed air jet configured to provide an air flow to initiateseparation of the product substrate from the carrier substrate andpenetrate locally into the interconnect layer of the stack from aperipheral edge of the interconnect layer; a first member having asurface extending in a plane generally parallel to a plane of a surfaceof the carrier substrate; and an extension portion extending from thefirst member, the extension portion including a surface configured tocontact a peripheral edge of the carrier substrate, wherein the systemapplies a force to the carrier substrate to bend the carrier substrateaway from the product substrate and thereby debond the product substratefrom the carrier substrate at a migrating detachment front, wherein theseparating means are independent of the extension portion and configuredto act locally on the detachment front, and wherein the separating meanscomprise a separating blade, the separating blade having a sharp edgeconfigured to act locally on the detachment front to initiate separationof the carrier substrate from the product substrate.